With this fourth anniversary issue of the EDA Tech Forum Journal, we have begun to make a few changes—more will follow over the coming months. In terms of content, the most obvious change is that we have introduced a new section dedicated to the role of embedded technologies in the design fl ow. It is […]
This paper describes the main design components and methodology priorities for development of the Sensium system-on-chip for wireless body sensor networks. The device is targeted at vital-sign monitoring and related medical applications. The SoC integrates an ultra-low-power wireless ISM band transceiver, hardware MAC, microprocessor, I/O peripherals, memories, 10b delta-sigma, analog-to-digital converter and custom interfaces. The […]
Signal integrity (SI) is an ever-growing problem as more interconnect effects and fast clocks increase the chances of crosstalk noise and glitches as well as unexpected signal delays. There has been a significant increase in SI-related timing violations due to the increasing influence of lateral wire capacitance in designs at 65 and 45nm. A fast-increasing […]
SystemVerilog, the standard that originated from Accellera and is now IEEE1800, is not just for Verilog users. VHDL users can also improve their design processes using its proven verification features. Anyone involved in systemon- chip (SoC) design may face a mixed-language environment and will appreciate being able to leverage SystemVerilog with the VHDL portions of […]
Changes in defect distribution, increasing design complexity and pressures from the specialist I/O and packaging arenas are creating a dilemma during component test. On the one hand, the generation of more test patterns would appear to be necessary; but on the other, fewer test ports are available. The article describes a strategy for addressing this […]
Electronic system level (ESL) design is moving to a new stage in its development, advancing from a proof-of-concept environment to one that is seeing its adoption and deployment at the forefront of design. The article terms this shift ‘ESL 2.0’. The reason for this goes beyond mere marketing hype. Inherent in the transition defined above […]
Cswitch’s CS90 Configurable Switch Array device has an interconnect structure, the dataCrossconnect network, that delivers bandwidth at 40- 100Gbps for packet-based applications. For packet handling tasks, the chip includes embedded configurable blocks, Configurable Packet Engines, that support functions such as frame parsing, CRC and hashing, and fast address look-ups, all at up to 1GHz. For […]
ARC International is one of the largest suppliers of configurable processor technology. It licenses patented configurable multimedia subsystems and CPU/DSP processors that are used to design differentiated products. They are optimized for use in systemson- chip (SoCs) that consume less power, are less expensive to produce and require protection from cloning. The ARC Energy PRO […]
Although no EDA company counts among its membership (for good practical reasons), it is fair to describe the US Consumer Electronics Association (CEA) as one of technology’s most broadly representative trade bodies. From retailers and brand holders to the hardware and software companies that directly supply components for CE products, the CEA has a position […]
The real objective of design for manufacturability (DFM) is to improve a product’s profitability and manufacturing predictability for its market window and unit volume by optimizing tradeoffs between design costs and manufacturing improvements according to a holistic, lifetime view of the product. Current DFM practice often falls far short of that goal. For instance, the […]
