Better upfront analysis can help avoid propagating errors from RTL into the netlist, and reveal a number of ways to improve the quality of your final design.
Many problems arise during the IP-to-SoC phase of FPGA-based prototyping due to the mix-and-match nature of the prototypes not the actual designs.
It’s time to take up the challenge of applying 3D integration technology to IC design. The manufacturing process technology is maturing, the tool chains are in place, and the opportunities to broaden your market by applying a new form of systemic integration are growing.
An increasingly important concept in design is that of product creation. An approach based on product creation looks beyond chip or board design.
Debug of logic and testbench debug makes up 35% of chip design, and is growing as power-management and hardware/software issues become part of the task.
How should you quiz your verification IP vendor to get the right VIP for your needs? Synopsys' Neill Mullinger details a checklist of the key points to raise.
finFETs are vital to the next generation of CMOS processes from Intel, TSMC and others. How will process issues including bulk vs SOI substrates, density limitations, thickness control, and planar device integration affect their practical implementation?
Mentor's Stephen Pateras explains how the proposed IJTAG standard speeds IP test by replacing time-consuming custom and ad hoc methodologies.
The advantages and challenges of 3D IC integration, as we add vertical functional integration options to the traditional planar integration brought by the progress of Moore's Law.
Manufacturability, routing, library design and more - it all needs rethinking at 20nm, writes Tong Gao of Synopsys.
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