What are the options and how do you balance overarching CAD requirements and personal preferences?
Both 3D IC and 2.5D IC techniques are being used on more designs and the DFT infrastructure is evolving to meet the challenges they pose.
Automating executable specifications as they evolve can deliver major efficiencies.
The Covid-driven MCU shortage for ECUs and elsewhere in vehicle design can bring entire production lines to a halt if not properly managed.
Linking multiple disciplines, and fully accounting for networks and distributed functionality are vital to automotive E/E design.
The strategy of designing for best power rather than for best timing in place-and-route delivers better results all around.
More optimistic about the semiconductor industries prospects than for some time, Siemens Joe Sawicki identified key EDA challenges at DAC.
Innovation is extending the technique's power across areas such as context-aware layout, accounting for multi-patterning and implementing fill.
Delivering physical implementations at new process nodes is getting ever harder. Learn how to stay on track by checking work is rule-compliant as you go.
Creating strong links between the electrical and mechanical design domains is a leading enabler of digitalization.
View All Sponsors