September 23, 2015
AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
June 18, 2014
How to enhance an 'ideal' parastitic extraction strategy to create a full 3D assembly-level parasitic netlist for simulation and circuit analysis.
September 24, 2013
Mobile and networking platforms need high bandwidth, low power consumption, and small footprint. These needs drove standards, such as LPDDR4, Wide I/O 2 and Hybrid Memory Cube.
August 12, 2013
3D-IC design is ready for take-off, following several years of intense collaboration to develop the necessary tools, methodologies and flows
May 8, 2013
Many design teams are looking at ways in which they can make use of 3D integration. Here are eight requirements for an effective 3D-IC design flow.
April 17, 2013
2.5D-IC integration overcomes 2D limitations such as cost, offchip bandwidth bottlenecks and I/O pin scarcity, and offers a route to true 3D-IC integration.
April 10, 2013
It’s time to take up the challenge of applying 3D integration technology to IC design. The manufacturing process technology is maturing, the tool chains are in place, and the opportunities to broaden your market by applying a new form of systemic integration are growing.
December 12, 2012
Meeting the challenges of moving beyond planar integration to side by side, and eventually truly stacked, dice, for designers, tool vendors and the supply chain.
November 1, 2008
Emerging technologies and markets could spur PCB tool growth despite economic concerns, says Mary Ann Olsson The worldwide PCB EDA software market maintained fairly stable 3.4% growth in 2007. Sales reached $532.5M, from $514.7M in 2006. The projected growth rate for PCB software in 2008 is 2.3%, bringing sales to $544.7M (Figure 1). One key […]