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March 29, 2018
3DIC technology provides performance boosts
3D integration technology has split into a number of different approaches, each of which brings a different combination of benefits in terms of performance.
Article | Topics:
IP - Assembly & Integration
,
EDA - DFM
| Tags:
3DIC
,
mixed-signal integration
,
thermal management
| Organizations:
Imec
EDA Topics
DFM
DFT
ESL
IC Implementation
Verification
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