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June 22, 2014
Monolithic 3DIC for SoC
Monolithic 3DIC integration may provide a viable alternative to conventional 2D scaling for SoCs if manufacturing problems can be overcome.
Guide | Topics:
EDA - IC Implementation
| Tags:
3DIC
,
FD-SOI
,
finFET
,
monolithic 3D
,
Moore's Law
,
thermal management
,
TSV
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