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directed self-assembly
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January 20, 2014
Patterning choices loom for 10nm and beyond
It is not just a choice between EUV and multiple patterning for future nodes, but even between varieties of multi-mask technologies. How will you decide?
Expert Insight | Topics:
EDA - DFM
,
IC Implementation
| Tags:
10nm
,
directed self-assembly
,
double patterning
,
e-beam lithography
,
LELE
,
lithography
,
SADP
,
self-aligned multiple patterning
| Organizations:
Mentor Graphics
January 13, 2014
Consider your options for future nodes
If EUV is further delayed until 8nm, the industry has to explore other options for patterning, and the effects they will have on the DFM flow.
Expert Insight | Topics:
EDA - DFM
| Tags:
14nm/16nm
,
directed self-assembly
,
double patterning
,
dummy fill
,
EUV
,
LELE
,
lithography
,
self-aligned multiple patterning
| Organizations:
Mentor Graphics
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