2.5D

February 29, 2024

The keys to ensuring IC quality

How the latest DFT techniques pave the way for quality and success for today's advanced designs.
Article  |  Topics: EDA - DFT  |  Tags: , , , , , , ,   |  Organizations: ,
January 19, 2023
Connectivity Management Feature - Jan 23

Putting it all together to accelerate 3D IC design

Learn how connectivity management solutions help you manage the multiple formats in which 3D IC components are delivered.
November 20, 2018
HDAP_FeaturedImage

Adding system-level, post-layout electrical analysis to HDAP design and verification

Adoption of high-density advanced packaging (HDAP) needs tools and supports to build designers' confidence in the emerging technology.
Article  |  Topics: EDA - IC Implementation, Verification  |  Tags: , , , , , ,   |  Organizations: , ,

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