Mentor Graphics

November 1, 2008

Inside the hot zone

Floorplanning informed by thermal analysis can significantly improve PCB layouts, writes Robin Bornoff The number of PCB design constraints seems ever increasing. The risk that a design will fail either functional performance or reliability goals grows for each generation. One increasingly popular trade-off addresses a balance between thermal compliance and signal integrity. Components with high […]

Article  |  Topics: PCB - System Codesign  |  Tags: ,   |  Organizations:

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