The leading EDA analyst also charts growth for RTL and IC CAD in 2014 Market Share Summary, and highlights system-driven shifts in tool evaluation.
Are we torn between evolution and revolution? Mentor Graphics' Joe Sawicki discusses how pattern matching already in fabs could move up and radically alter the design flow.
Two approaches to greater reliability revealed in Synopsys ATPG and DesignWare updates
Whether you're going to DAC this week or not, it's worth remembering one of the other key factors that will inform your judgments on new tools.
New MicReD power tester identifies failure causes without the need for post-test lab analysis
Stacked 3D-IC memory-on-logic is on the packaging company's roadmap, but there are still yield hurdles to scale at the MEOL.
FinFETs, ever proliferating verification, 3DIC, security and more feature on our guide to some of the most intriguing panels at DAC 2013.
Mentor's Stephen Pateras explains how the proposed IJTAG standard speeds IP test by replacing time-consuming custom and ad hoc methodologies.
Texas Instruments had good news for teams that want to assemble 3DIC stacks using thru-silicon vias (TSVs). The stress induced by the copper TSVs is not as bad as many feared for nanometer-scale transistors.
We’ve just heard from the Small Form Factor Special Interest Group (SFF-SIG) that the RS-DIMM rugged embedded memory featured in the latest print edition of Tech Design Forum and online has been renamed XR-DIMM (eXtreme Rugged Dual In-Line Memory Module) with immediate effect. Paul Rosenfeld, SFF-SIG’s president, says the change is intended to “reflect the […]