Managing finFET variability issues without extending design times is key to extracting the most from the new processes, key players told a panel at the recent SNUG meeting in Santa Clara.
Registration is free-of-charge to attend Mentor, Oracle and Samsung keynotes and choose from nine technical tracks at one-day event.
Glass may be the high frequency interposer option given silicon concerns about power and noise. TSMC adds another pathfinder to its 3D arsenal.
Industry-wide innovation is required to make scaling cost-effective at 7nm, says Qualcomm's VP of Technology. Time for a fat, cholesterol and MSG-free diet.
A leading researcher argues that graphene will not replace but complement silicon and thrive in specialist applications.
Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.
Dr Ron Black also discussed his experiences with the Internet of Things in a lively keynote at the GSA Memory+ Conference in Taipei
Stacked 3D-IC memory-on-logic is on the packaging company's roadmap, but there are still yield hurdles to scale at the MEOL.
DAC to link chip, software and system design to automotive OEMs with a new track covering 21 topics within four themes. Call for abstracts now open.
Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.
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