Foundry veteran Simon Yang told Semicon China while things are looking up the country cannot count on ‘traditional’ methods or advantages if it's to be a major chipmaker.
Comms giant to seek out more local partnerships with China poised to account for a third of car sales with each new vehicle featuring 1,000 semis.
The $99 discount registration price for Cadence's main US user conference will no longer be available after Friday (March 20)
DVCon Europe brings design and verification insights to Munich next week.
Manufacturing giant says we need a new category of WPUs - wearables processing units - to create a mass market and that ARM needs to go smaller than the MO.
Focus on systemic issues matches DVCon Europe event to European interests
Any conference can only be as good as the feedback it gets. And next year's DAC team is actively looking for yours. It'll be worth your time.
Panel discusses Moore's law scaling beyond the 14nm node to 5nm, where economic, device, interconnect, materials, lithography and design issues abound
Building the internet of Things will demand collaboration and a healthy ecosystem
Head of TSMC R&D talks about what it will take to develop and use 10nm, 7nm processes, and a possible shift to using packaging to extend Moore's law scaling
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