Conferences

June 25, 2014

Don’t just whine – it’s time for you to help shape DAC 2015

Any conference can only be as good as the feedback it gets. And next year's DAC team is actively looking for yours. It'll be worth your time.
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June 13, 2014

Path to 5nm plotted at DAC panel

Panel discusses Moore's law scaling beyond the 14nm node to 5nm, where economic, device, interconnect, materials, lithography and design issues abound
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June 12, 2014

Internet of Things: an opportunity, but for whom?

Building the internet of Things will demand collaboration and a healthy ecosystem
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June 5, 2014

Cliff Hou, TSMC VP R&D, on the route to 10nm – and beyond

Head of TSMC R&D talks about what it will take to develop and use 10nm, 7nm processes, and a possible shift to using packaging to extend Moore's law scaling
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June 5, 2014

EDA industry must look to new markets for growth – Rhines

New markets such as hardware cyber security, automotive and embedded software key to EDA industry growth
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June 2, 2014

Samsung certifies Synopsys tools, IP at 14nm

Samsung, Synopsys and ARM have been working together to create a finFET design ecosystem.
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June 2, 2014

Mentor’s Wally Rhines on tools as a cultural issue

Whether you're going to DAC this week or not, it's worth remembering one of the other key factors that will inform your judgments on new tools.
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April 16, 2014

FinFET variability issues challenge advantages of new process

Managing finFET variability issues without extending design times is key to extracting the most from the new processes, key players told a panel at the recent SNUG meeting in Santa Clara.
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April 3, 2014

Mentor’s User2User Silicon Valley conference this week

Registration is free-of-charge to attend Mentor, Oracle and Samsung keynotes and choose from nine technical tracks at one-day event.
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December 16, 2013

TSMC hints at glass interposer for mobile SoCs

Glass may be the high frequency interposer option given silicon concerns about power and noise. TSMC adds another pathfinder to its 3D arsenal.
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