Conferences

April 16, 2014

FinFET variability issues challenge advantages of new process

Managing finFET variability issues without extending design times is key to extracting the most from the new processes, key players told a panel at the recent SNUG meeting in Santa Clara.
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April 3, 2014

Mentor’s User2User Silicon Valley conference this week

Registration is free-of-charge to attend Mentor, Oracle and Samsung keynotes and choose from nine technical tracks at one-day event.
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December 16, 2013

TSMC hints at glass interposer for mobile SoCs

Glass may be the high frequency interposer option given silicon concerns about power and noise. TSMC adds another pathfinder to its 3D arsenal.
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December 16, 2013

Qualcomm’s take on preserving Moore’s Law economics

Industry-wide innovation is required to make scaling cost-effective at 7nm, says Qualcomm's VP of Technology. Time for a fat, cholesterol and MSG-free diet.
December 10, 2013

Graphene gets a reality check

A leading researcher argues that graphene will not replace but complement silicon and thrive in specialist applications.
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November 7, 2013

TSMC demonstrates readiness for 3D-IC

Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.
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November 4, 2013

Rambus CEO calls for collaboration and an architectural focus for memory

Dr Ron Black also discussed his experiences with the Internet of Things in a lively keynote at the GSA Memory+ Conference in Taipei
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November 4, 2013

Amkor keeps question mark next to ‘full’ 3D-IC in 2016

Stacked 3D-IC memory-on-logic is on the packaging company's roadmap, but there are still yield hurdles to scale at the MEOL.
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October 24, 2013

DAC 2014 aims to build design bridge to automotive

DAC to link chip, software and system design to automotive OEMs with a new track covering 21 topics within four themes. Call for abstracts now open.
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October 23, 2013

3D-IC focus for GSA’s Taipei Memory+ event next week

Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.

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