Electrical analysis facility does RC extraction on virtual fab models, accelerating the availability of early PDKs for new processes
NXP discusses second silicon flavor for automotive radar, after earlier launch of postage-stamp devices.
Microsoft has launched an OEM version of the Windows Holographic platform it has developed for its own AR headset, the HoloLens.
The functional verification specialist will discuss the latest updates to Ascent and Meridian - and offer top quality espresso at this year's conference.
An overview of the vendor's busy DAC program from panels to technical sessions to a one-to-one with Wally Rhines.
The company's annual 'What to see' list is now available for download and highlights some of EDA's less recognized areas of innovation.
Companies presenting at User2User Santa Clara on April 26 include AMD, Microsoft, nVidia, Oracle, Qualcomm, and Samsung.
But project lead Chenming Hu, 'finFET's father', has also highlighted important changes in the funding landscape for university research.
The EDA Consortium is rebranding and extending its activities to better reflect all the tools and services that now comprise IC design.
Directed self assembly techniques may offer similar benefits to EUV lithography, especially for DRAM makers, says SPIE conference paper
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