April 26, 2019
A digital twin is now more than just a virtual copy of a product. For Siemens, it is a multilayered concept powering a 'boundary-free innovation platform'.
April 18, 2019
Mentor's technical conference will take place on May 2 at the Santa Clara Marriott and feature more than 45 user and vendor presentations.
April 4, 2019
An Open Compute Project group working on multichip integration sees a combination of parallel and serial interfaces being important for interchip communication.
April 2, 2019
Cadence has launched a web-based EDA service the company hopes will ease the transition from self-hosted computing to more flexible cloud-based development.
March 26, 2019
UK-based Trackwise has shipped what could easily be the longest ever flexible PCB with a 26m-long substrate to deliver power and control to a UAV's wings.
March 18, 2019
The ODSA Workgroup formed by Netronome and others is looking to adopt the PIPE standard for interconnecting chiplets as it starts work on a proof-of-concept module.
March 12, 2019
The Design Automation Conference (DAC) has kicked off free registration for the exhibit floor at early June's Las Vegas event.
March 6, 2019
MACOM has decided to use GlobalFoundries' 90nm SOI process on 300mm wafers to build higher-integration optical-switching devices for servers.
February 21, 2019
The company will share a stand at EmbeddedWorld in Nuremberg with its sister Siemens division Polarion and has seven papers across the technical program.
November 15, 2018
Mentor's flagship PCB suite is aiming to offer another 'shift left' in verification as respins rise.