Deep pipelines and dynamic memory sharing may provide the key to the development of faster and more efficient server-farm blades as the focus in hardware design moves to augmenting conventional processors with specialized accelerators.
An overview of the vendor's busy DAC program from panels to technical sessions to a one-to-one with Wally Rhines.
A new dedicated automotive power tester helps cut simulation errors to just 0.5% with more faithful calibration.
The latest release of Cadence's Allegro deals with flex PCBs, material inlays as well as tighter links to signal integrity.
Companies presenting at User2User Santa Clara on April 26 include AMD, Microsoft, nVidia, Oracle, Qualcomm, and Samsung.
HyperLynx from Mentor Graphics has moved into a new generation with more integrated features beyond PI and SI, and an easier to use GUI.
The EDA Consortium is rebranding and extending its activities to better reflect all the tools and services that now comprise IC design.
The 53rd Design Automation Conference has published its program for the upcoming event in Austin, Texas, which will include keynotes from AMD, nVidia, and NXP Semiconductors and tracks that connect electronics to biology.
Tektronix has aimed a pair of RF instruments at the growing number of engineering teams trying to incorporate low-power wireless communications into their designs.
Tektronix has moved the some of the active signal-conditioning to the tip to develop a probe for oscilloscopes that can handle bandwidths up to 20GHz and with less need for de-embedding techniques.
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