An emulator that extends the reach of hardware acceleration into the world of multiphysics analysis could result from the merger of Siemens PLM Software with Mentor.
TSMC encapsulated the multiple chips assembled on a 1200mm2 silicon substrate to cut the chance of damage from warping with the company's CoWoS2 SiP technology.
An ASIC-based design has allowed Tektronix to build an oscilloscope that can mix and match analog and digital channels.
Mentor, a Siemens business, has formed an alliance with foundries and OSAT providers and launched a flow that brings IC and package design together.
Cadence Design Systems has brought its chip- and PCB-design environments closer together as the shift towards multichip packages gains pace.
For the ninth year, I Love DAC badges will provide free access to the Design Automation Conference exhibition and pavilion sessions.
The ESD Alliance is relaunching the annual panel session featuring CEOs from ARM, Cadence Design Systems, Mentor Graphics and Synopsys in Mountain View on April 9.
The Mentor Safe program aims to increase automotive users' confidence in tools and provide documentation needed for the functional safety standard.
Xpedition adds vibration and acceleration analysis to shorten physical PCB test times for ruggedized and safety-critical designs.
Three Mentor divisions - Embedded, PADS and Tanner EDA - will present their latest innovations during the conference and exhibition in Nuremberg next week.
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