PCB

February 1, 2024

Future Facilities core drives Cadence thermal suite

Cadence has introduced a platform for performing thermal and thermal-stress analysis of subsystems, from 2.5D and 3DICs to PCBs and complete electronic assemblies.
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November 16, 2023

Cadence and Autodesk bring together cloud CAD tools

Cadence and Autodesk have linked their respective cloud-based PCB and mechanical design tools.
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September 20, 2023

AI aims to cut CAD-model generation time

Ultra Librarian has developed an AI-driven CAD modeling engine that should slash the the time it takes to build component and subsystem models for PCB layout and system design.
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September 14, 2023

Cadence gives OrCAD access to cloud AI placement

Cadence has given its new release of OrCAD access to the cloud-based AI placer designed for its Allegro PCB-layout software.
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June 14, 2023

Siemens pulls supply-chain data into Xpedition

Siemens is integrating the Supplyframe platform with the Xpedition PCB-design software to give engineers better visibility into component availability.
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June 12, 2023

Air-filled waveguides to cut losses in mass-market radar

AT&S and Imec partnered to develop a way of putting low-loss waveguides into conventional PCBs to support D-band automotive radar and 6G modules.
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June 1, 2023

Does 2.5DIC call for IC design tools for the packaging?

Siemens has published a white paper that examines whether package designers need to adopt IC tools and design styles in the move from organic packages to 2.5DIC packages.
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April 6, 2023

Cadence adds AI to PCB design

Cadence Design Systems has expanded its use of machine learning for EDA into PCB design, joining a growing number of suppliers who have decided it is a sector that needs the AI treatment.
December 1, 2022

Identifying AI opportunities in PCB design

The key to exploiting AI is being clear about where its family of technologies can help to improve and democratize design.
November 23, 2022

Chipletz pushes packaging design for AI, HPC and immersive use-cases

The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.
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