PCB

April 20, 2018

SEMI-ESDA tie-up aims to extend EDA’s global reach

Cooperation in key verticals such as automotive and changes for DAC as well as global conference outreach underpin EDA association's move.
April 10, 2018

Cadence tunes Virtuoso for 5nm and SIP

Cadence Design Systems has made enhancements to its Virtuoso mixed-signal layout tool at both the system-level and nanometer-design levels for its 18.1 release.
Article  |  Tags: , , , , ,   |  Organizations:
February 13, 2018

HyperLynx update automates SerDes validation

Simulation suite automates the largely manual process of validating more than 25 SerDes protocols.
Article  |  Tags: , , , , , ,   |  Organizations:
January 23, 2018

Capacity shortages loom if 2017 growth repeats

If current market trends persist, shortages in wafers are likely to follow, hurting the ability of some companies to ship silicon and boost the prices for those who can.
Article  |  Tags: , ,   |  Organizations: ,
January 2, 2018

The best in PCB design during 2017

Read some edited highlights from the most successful companies in Mentor's 2017 Technology Leadership Awards.
December 18, 2017

PCB tool rewrite to expand platform choices

Altium has rewritten its PCB-design software to improve graphics performance and provide the opportunity to port to non-Windows operating systems such as OS X.
Article  |  Tags: , ,   |  Organizations:
October 12, 2017

VLSI Symposia 2018 looks to machine learning

Machine learning is among the focus topics at next year's Symposia on VLSI Technology & Circuits in Honolulu, which has issued its call for papers.
June 20, 2017

Siemens sees Mentor helping to build fast digital twins

An emulator that extends the reach of hardware acceleration into the world of multiphysics analysis could result from the merger of Siemens PLM Software with Mentor.
Article  |  Tags: , , , , , , , ,   |  Organizations: ,
June 18, 2017

TSMC encapsulates CoWoS for supersized SiP

TSMC encapsulated the multiple chips assembled on a 1200mm2 silicon substrate to cut the chance of damage from warping with the company's CoWoS2 SiP technology.
Article  |  Tags: , , ,   |  Organizations:
June 6, 2017

Tektronix scope reconfigures for mixed signals

An ASIC-based design has allowed Tektronix to build an oscilloscope that can mix and match analog and digital channels.
Article  |  Tags: , , ,   |  Organizations:

PLATINUM SPONSORS

Synopsys Cadence Design Systems Mentor - A Siemens Business
View All Sponsors