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June 20, 2017

Siemens sees Mentor helping to build fast digital twins

An emulator that extends the reach of hardware acceleration into the world of multiphysics analysis could result from the merger of Siemens PLM Software with Mentor.
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June 18, 2017

TSMC encapsulates CoWoS for supersized SiP

TSMC encapsulated the multiple chips assembled on a 1200mm2 silicon substrate to cut the chance of damage from warping with the company's CoWoS2 SiP technology.
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June 6, 2017

Tektronix scope reconfigures for mixed signals

An ASIC-based design has allowed Tektronix to build an oscilloscope that can mix and match analog and digital channels.
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June 5, 2017

Mentor builds links for multichip package integration

Mentor, a Siemens business, has formed an alliance with foundries and OSAT providers and launched a flow that brings IC and package design together.
May 30, 2017

Cadence pulls Virtuoso and Allegro closer for 3DIC

Cadence Design Systems has brought its chip- and PCB-design environments closer together as the shift towards multichip packages gains pace.
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April 4, 2017

Registration opens for I Love DAC program

For the ninth year, I Love DAC badges will provide free access to the Design Automation Conference exhibition and pavilion sessions.
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March 24, 2017

The return of the CEO Outlook

The ESD Alliance is relaunching the annual panel session featuring CEOs from ARM, Cadence Design Systems, Mentor Graphics and Synopsys in Mountain View on April 9.
March 7, 2017

Reducing the documentation burden in ISO 26262

The Mentor Safe program aims to increase automotive users' confidence in tools and provide documentation needed for the functional safety standard.
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March 6, 2017

Mentor’s Xpedition virtualizes simulation for ruggedized, safety-critical designs

Xpedition adds vibration and acceleration analysis to shorten physical PCB test times for ruggedized and safety-critical designs.
March 6, 2017

Embedded World 2017 preview: Mentor Graphics

Three Mentor divisions - Embedded, PADS and Tanner EDA - will present their latest innovations during the conference and exhibition in Nuremberg next week.

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