PCB

July 11, 2016

Mentor’s PADS family extended for AMS, DDR and electrical DRC

Mentor Graphics has added four new units to its PADS PCB family addressing increasing complexity in mainstream design.
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June 8, 2016

Minimize memory moves for greener data centers

Deep pipelines and dynamic memory sharing may provide the key to the development of faster and more efficient server-farm blades as the focus in hardware design moves to augmenting conventional processors with specialized accelerators.
May 25, 2016

DAC 2016 preview: Mentor Graphics

An overview of the vendor's busy DAC program from panels to technical sessions to a one-to-one with Wally Rhines.
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May 23, 2016

Mentor integrates automotive IGBT test and simulation

A new dedicated automotive power tester helps cut simulation errors to just 0.5% with more faithful calibration.
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May 3, 2016

Allegro release tackles new generations of PCB

The latest release of Cadence's Allegro deals with flex PCBs, material inlays as well as tighter links to signal integrity.
April 13, 2016

User2User preview: Silicon Valley edition rolls out this month

Companies presenting at User2User Santa Clara on April 26 include AMD, Microsoft, nVidia, Oracle, Qualcomm, and Samsung.
April 4, 2016

HyperLynx made broader and easier to use

HyperLynx from Mentor Graphics has moved into a new generation with more integrated features beyond PI and SI, and an easier to use GUI.
March 31, 2016

Meet the Electronic System Design Alliance

The EDA Consortium is rebranding and extending its activities to better reflect all the tools and services that now comprise IC design.
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March 31, 2016

53rd DAC conference program announced

The 53rd Design Automation Conference has published its program for the upcoming event in Austin, Texas, which will include keynotes from AMD, nVidia, and NXP Semiconductors and tracks that connect electronics to biology.
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March 22, 2016

Spectrum analyzers aim for IoT projects

Tektronix has aimed a pair of RF instruments at the growing number of engineering teams trying to incorporate low-power wireless communications into their designs.
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