Blog Topics

Cadence has introduced a platform for performing thermal and thermal-stress analysis of subsystems, from 2.5D and 3DICs to PCBs and complete electronic assemblies.

Workshops on portable stimulus, functional safety, verification of RISC-V processors, and design with chiplets and large language models will feature at the upcoming 2024 DVCon US.

The two best papers at the recent DVCon Europe underlined two of the issues that now face chip-implementation teams: efficient flows and reliability.

Shifting to low-carbon generation for electricity would do much to cut the carbon footprint of semiconductor processes according to work shown at this year’s IEDM.

At IEDM, CEA-Leti described a process that avoids the thermal problems of implementing CMOS transistors in the metal stack using monolithic integration.

Applied Materials and CEA-Leti have expanded their collaboration with the creation of a joint lab to develop materials useful for sensors, RF communications, and power devices, and with a focus on heterogeneous integration.

Start-up launches platform on path to the specification, emulation and simulation of large chiplet-based designs.

EMA Design Automation to launch sister company, Accelerated Designs, to help clients streamline processes, cut manual effort, and connect data.

Solido discusses how it has leveraged AI for SPICE level efficiency and the benchmarks it has used.

Arm has added machine-learning extensions and pointer-security instructions to its latest Cortex-M series core.