IP

May 21, 2019

Achronix deploys network on chip for faster FPGAs

Achronix is introducing an FPGA architecture that pulls a full network-on-chip into the programmable-logic fabric combined with hardened matrix-math processors for AI.
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May 20, 2019

DAC 2019 preview: Mentor

Mentor is active across the program and its main and Verification Academy booths within the exhibition in Las Vegas.
May 3, 2019

ES Design West outreach attracts launch participants

EDA and IP supporters of the new event see the goal of greater integration with the electronic systems supply chain as fundamental to their involvement.
April 24, 2019

May meeting to push for UVM analog extensions

Accellera is trying to standardize extensions to UVM for mixed-signal design.
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April 22, 2019

Machine learning and chiplets headline VLSI Symposia

Large-scale MCMs and novel device architectures bookend the papers on machine learning at VLSI Symposia in an event that will also cover chiplet integration and other topics.
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April 12, 2019

DesignWare gets automotive boost with GLOBALFOUNDRIES 22FDX SOI qualification

Synopsys and GLOBALFOUNDRIES are developing a portfolio of automotive IP for the chipmakerā€™s 22nm fully depleted silicon-on-insulator (22FDX) process.
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April 2, 2019

Catapult HLS integrates eFPGA IP for faster development

Menta eFPGA IP is highly configurable making it well suited to the evolving designs that exploit HLS abstraction.
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March 26, 2019

DVCon Europe looks to software in call for papers

DVCon Europe has added embedded software, digital twin, machine learning, and RISC-V to the topics the conference organizers want to cover.
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March 20, 2019

Microsoft offers free RTL for fast server compression

Not only has Microsoft decided to make a compression algorithm intended for data centers open source, the company the company is providing its own RTL to anyone who wants to implement it in silicon.
March 18, 2019

PCI may provide key to OCP chiplet standard

The ODSA Workgroup formed by Netronome and others is looking to adopt the PIPE standard for interconnecting chiplets as it starts work on a proof-of-concept module.

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