EDA

January 19, 2015

Ambiq uses subthreshold techniques to cut power on ARM MCUs

Research by the University of Michigan into subthreshold circuit design has led to spinoff company Ambiq Micro creating a family of microcontrollers that it claims provide an ARM Cortex-M4F with power consumption at levels normally associated with an M0+.
January 7, 2015

CEA-Leti deals with heat issue on monolithic 3DIC

At IEDM 2014, CEA-Leti presented a technique that prevents damage to base-layer transistors in monolithic 3DIC processes. As work progresses, the institute is preparing to receive 3DIC designs in 2017.
January 5, 2015

Cadence high-level synthesis changes deal with congestion

SystemC coding style can lead to excessive congestion in the logic generated by high-level synthesis. Cadence described how it is attacking the issue at its recent Front-End Design Summit.
December 18, 2014

Gary Smith EDA: PCB ‘a door to the future’ but ‘slow take-off’ for ESL

The leading EDA analyst also charts growth for RTL and IC CAD in 2014 Market Share Summary, and highlights system-driven shifts in tool evaluation.
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December 16, 2014

14nm/16nm finFETs debut at IEDM

The International Electron Device Meeting (IEDM) has once again provided a chance for the major chipmakers to go head-to-head with their latest processes - this time with finFETs.
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December 11, 2014

Use-cases drive high-level verification tool

Cadence has released a tool intended to ease the creation of scenario-driven tests to better exercise complex IP and SoC designs.
November 24, 2014

A57 finFET design underlines routing challenges

In a presentation at the recent ARM TechCon, HiSilicon described the issues in putting together a 16nm finFET-based design built around a cluster of ARM’s Cortex A57 processors.
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November 18, 2014

Startup builds environment for custom EDA tools

Canadian startup Invionics has launched a development environment and packager intended to make it easier for users within chipmakers and design houses to build customized tools.
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November 12, 2014

TSMC begins risk production of 16FF+

TSMC says it has begun risk production on its FinFET Plus (16FF+) process, claiming that it has reached a greater level of maturity earlier in its development cycle than previous nodes developed at the foundry.
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November 4, 2014

From Darwin to Mao: how multi-patterning could move up the flow

Are we torn between evolution and revolution? Mentor Graphics' Joe Sawicki discusses how pattern matching already in fabs could move up and radically alter the design flow.

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