EDA

September 19, 2014

Cisco to absorb smart-memory IP

Cisco has decided to buy memory-controller specialist Memoir Systems and absorb the technology into its Insieme business unit, which specializes in data-center switch technologies, a move that underlines the issues facing small IP suppliers and their customers.
September 17, 2014

New flows needed for the ‘insects of the SoC world’

Chris Rowen, CTO of the IP group at Cadence Design Systems, expects the internet of things (IoT) to cause a split in approaches to SoC design, one of a set of predictions about the nascent market.
September 11, 2014

TSMC: e-beam winning on cost over EUV for lithography

EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.
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September 10, 2014

Foxconn’s wishlist for wearables and the Internet of Things

Manufacturing giant says we need a new category of WPUs - wearables processing units - to create a mass market and that ARM needs to go smaller than the MO.
September 2, 2014

IoT mixed signal design: keep everything in the green

ARM and Cadence have teamed up to show how system-level and implementation-level representations of a mixed-signal design can be linked together and kept in sync as the project progresses.
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August 19, 2014

Simulations point to better performance for Intel 14nm finFET

Gold Standard Simulations has run simulations to work out how much of an improvement Intel's new rectangular shape represents.
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August 18, 2014

Power and clocking at 20nm force changes in FPGAs

Design for the 20nm generation of processes has revealed power and clocking issues for the two major FPGA manufacturers presentations at Hot Chips revealed.
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August 13, 2014

Thermal limits challenge Hot Chips power pair

Two of the custom designs presented at the 26th Hot Chips in Cupertino exemplified the problems caused by increasing power density and the benefits of looking at heat removal at the system level.
August 8, 2014

Custom instrumentation helps build models for more advanced RF amplifiers

High peak-to-average ratios inherent in 4G/5G modulation schemes are driving the circuitry controlling RF PAs to become more modeling-oriented.
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August 7, 2014

NI aims to bring design and production closer with chip-test plan

National Instruments plans to build an ecosystem around semiconductor test that could provide a missing link between the design process and production.
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