EDA

February 18, 2019

How to optimize your testbench-to-DUT connections

Testbench connections often depend on the virtual interface feature of SystemVerilog but other options - like abstract classes - can help.
February 15, 2019

China Focus 1: Wally Rhines maps startup and design growth

In the first of a weekly series on China's evolving design sector, we look at how the Mentor President and CEO identifies some of the key drivers.
February 12, 2019

IEDM looks to spin glasses and brain-like platforms

IEDM plans to expand its range of coverage for the 2019 event to encompass a range of novel computing platforms, from neuromorphic architectures to machines that emulate thermodynamic systems.
Article  |  Tags: , ,   |  Organizations:
February 11, 2019

DVCon USA 2019 preview: Mentor

DVCon USA is coming soon. Mentor's 2019 involvement includes a keynote from parent Siemens and a tutorial on managing your formal verification processes.
February 8, 2019

Taking an IoT edge design from proof-of-concept to prototype

A new paper describes a case study for a pressure-sensing IoT application based on the ARM DesignStart platform and Mentor IoT tool flow.
Article  |  Tags: , , , ,   |  Organizations: ,
February 1, 2019

Fast process access gets Moortec onto 7nm

Early access to tools for new processes is helping Moortec deliver IP to determine the real-time health of on-chip circuits.
January 22, 2019

HPC futures report puts acceleration first

A report put together by Europe's HiPEAC high-performance computing research network argues computing is at an architectural turning point
January 21, 2019

Video series details the physical verification process

Physical verification challenge of large SoCs on leading-edge processes detailed in video series
Article  |  Tags: , , ,   |  Organizations:
December 12, 2018

IEDM shows progress on embedded eMRAM

Embedded magnetic RAM is emerging as a contender for on-chip memory not just from a density standpoint but from that of power.
Article  |  Tags: , , , , ,   |  Organizations: , , ,
December 5, 2018

Leti takes the heat off monolithic 3D

CEA-Leti claimed at IEDM to have achieved major steps in bringing monolithic 3D integration closer to production readiness.
Article  |  Tags: , ,   |  Organizations:

PLATINUM SPONSORS

Synopsys Cadence Design Systems Mentor - A Siemens Business
View All Sponsors