Blog Topics

September 2, 2015

Early registration opens for DVCon Europe 2015

Early registration has opened for the DVCon Europe conference to be held in Munich, Germany in November.
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July 28, 2015

Samsung applies early prediction and color management to 10nm plans

Rapid virtual prototyping and a metal stack that's more designer friendly are two of the ways in which Samsung aims to build up foundry market share for its 14nm and 10nm finFET processes.
July 15, 2015

PSpice builds interfaces to PCB and system-level cosimulation

The need for virtual prototyping at the PCB-design has led to changes in the way PSpice is being used – with much greater emphasis on cosimulation.
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July 13, 2015

GlobalFoundries tunes 28nm for smaller, lower-power FD-SOI

GlobalFoundries has developed variants of the 28nm FD-SOI process that offer smaller die sizes and lower-power operation.
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July 9, 2015

IBM and friends at 7nm: breakthrough or science project?

IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
July 8, 2015

Remembering Gary Smith

The leading EDA analyst passed away late last week after a short illness. Graham Bell offers this remembrance.
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June 30, 2015

Chipmakers see 3x test-pattern saving in embedded-test logic

Companies such as Broadcom are experiencing threefold test-pattern reductions through the use of automatically inserted gates that allow parallel cones to share the same ATPG patterns that would not be possible using conventional test generation schemes.
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June 29, 2015

FastSpice update improves parallelism and adds wreal support

The latest update to the CustomSim FastSpice tool from Synopsys provides more consistent speedups from multicore workstations and adds support for BCD processes and real-number modeling.
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June 26, 2015

‘This sensor will self-destruct in the next five (hundred thousand) seconds’

Research by Professor John Rogers' group at the University of Illinois is leading to biodegradable electronics, for both defense and medical applications.
June 25, 2015

X-Fab updates 180nm SOI process for automotive and industrial applications

Foundry claims isolation and device integration advantages for 180nm SOI process, help to absorb extra costs of SOI wafers
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