Managing finFET variability issues without extending design times is key to extracting the most from the new processes, key players told a panel at the recent SNUG meeting in Santa Clara.
The first in a series of articles on how various vendors are addressing the flow's most challenging task looks at Mentor's strategy for emulation.
But some research and process collaboration is set to continue in the background as Samsung, GlobalFoundries and IBM chart their own priorities.
Enterprise Verification Platform adds cross-over SystemVerilog, UVM, and UPF support for Veloce alongside new hardware and software debuggers.
ARM has decided to shift from using its in-house compiler technology to the open-source combination of Clang and LLVM.
The 2013 edition of the International Technology Roadmap for Semiconductors has been published. The latest set of tables underlines the slowdown in some aspects of scaling, particularly when it comes to metal interconnect.
The 51st Design Automation Conference, to be held in San Francisco in early June, is offering free exhibit floor entry for the full three days.
Power converters are arriving on the market with the aim of simplifying the job of building energy-harvesting systems for wireless sensor nodes and the Internet of Things.
For its Printed Electronics conference, IDTechEx pulled together a team together with P&G to develop a collaborative demonstration of the technology.
Registration is free-of-charge to attend Mentor, Oracle and Samsung keynotes and choose from nine technical tracks at one-day event.
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