Signal integrity (SI) is an ever-growing problem as more interconnect effects and fast clocks increase the chances of crosstalk noise and glitches as well as unexpected signal delays. There has been a significant increase in SI-related timing violations due to the increasing influence of lateral wire capacitance in designs at 65 and 45nm. A fast-increasing […]
The paper describes some of the main challenges in the latest process shrink for the Cell Broadband Engine, developed jointly by IBM, Sony and Toshiba. The authors show how the move from a 65nm to a 45nm SOI process was achieved by concentrating on four primary goals: automating the migration; setting a 30% power reduction […]
Electronic system level (ESL) is typically defined as design above the register transfer level (RTL). When applied to hardware design, ESL is the process of describing hardware functionality at higher levels of abstraction to increase designer productivity and enable greater degrees of exploration. With ESL, hardware designers no longer spend most of their time designing […]
Electronic system level (ESL) design is moving to a new stage in its development, advancing from a proof-of-concept environment to one that is seeing its adoption and deployment at the forefront of design. The article terms this shift ‘ESL 2.0’. The reason for this goes beyond mere marketing hype. Inherent in the transition defined above […]
Cswitch’s CS90 Configurable Switch Array device has an interconnect structure, the dataCrossconnect network, that delivers bandwidth at 40- 100Gbps for packet-based applications. For packet handling tasks, the chip includes embedded configurable blocks, Configurable Packet Engines, that support functions such as frame parsing, CRC and hashing, and fast address look-ups, all at up to 1GHz. For […]
ARC International is one of the largest suppliers of configurable processor technology. It licenses patented configurable multimedia subsystems and CPU/DSP processors that are used to design differentiated products. They are optimized for use in systemson- chip (SoCs) that consume less power, are less expensive to produce and require protection from cloning. The ARC Energy PRO […]
Although no EDA company counts among its membership (for good practical reasons), it is fair to describe the US Consumer Electronics Association (CEA) as one of technology’s most broadly representative trade bodies. From retailers and brand holders to the hardware and software companies that directly supply components for CE products, the CEA has a position […]
The real objective of design for manufacturability (DFM) is to improve a product’s profitability and manufacturing predictability for its market window and unit volume by optimizing tradeoffs between design costs and manufacturing improvements according to a holistic, lifetime view of the product. Current DFM practice often falls far short of that goal. For instance, the […]
The headline number in the Consumer Electronics Association’s (CEA) latest market forecast contained a few devils in the detail, although the sector does seem poised to defy more pessimistic views of the economy’s prospects. The projection of 6.1% growth for 2008 is robust, giving just over $171bn in US factory door sales (Figure 1).Meanwhile, GDP […]
In his early days in the semiconductor industry, Morris Chang Morris Chang was one of the “non-Texans” to Texas Instruments and was a manager struggling with the question of how to get individual transistor yields to somewhere around three or even four per cent. One of his colleagues – another immigrant to the Lone Star […]
