IC Implementation

November 20, 2018
HDAP_FeaturedImage

Adding system-level, post-layout electrical analysis to HDAP design and verification

Adoption of high-density advanced packaging (HDAP) needs tools and supports to build designers' confidence in the emerging technology.
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June 18, 2018
Andy Ladd is president and CEO of Baum. He has more than 30 years of experience in the electronics industry. Ladd received a Bachelor of Science degree in Computer Engineering from the University of Illinois at Champaign/Urbana, and a Master of Science degree in Engineering from the University of Michigan at Ann Arbor.

Power analysis isn’t just for battery-operated products

Andy Ladd highlights the wide range of peak-power concerns around plugged-in devices.
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May 31, 2018
layout file feature

Layout-database file control: the missing link

The authors descirbe a new signature-based approach to resolving the content of layouts in GDSII, OASIS and other formats.
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April 23, 2018

How eFPGAs will help build the brave new world of AI

Artificial intelligence and machine learning require the performance and flexibility offered by embedded FPGA (eFPGA) technology.
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April 9, 2018

ISO 26262 – The Second Edition: what’s in it… and what isn’t

A new version of the automotive safety standard arrives later this year. Review the main updates and see how it will combine with the incoming SOTIF autonomous driving standard.
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December 22, 2017

Improve custom/AMS design and productivity with in-design DRC

In-design DRC is a technique that frees up engineers from many of the challenges of delivering AMS design under ever more complex design rules.
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November 24, 2017
John Ferguson is the Director of Marketing for Calibre DRC Applications at Mentor, a Siemens Business, in Wilsonville, Oregon, with extensive experience in physical design verification. He holds a BS degree in Physics from McGill University, an MS in Applied Physics from the University of Massachusetts, and a PhD in Electrical Engineering from the Oregon Graduate Institute of Science and Technology.

Assessing the true cost of node transitions

John Ferguson reviews the key capital metrics you need to review when deciding whether to move to a new process.
October 14, 2017
Michael Chen is Director, Design for Security, in the New Ventures Division of Mentor, a Siemens Business.

Making security a profit center for silicon

The assumption has been that extra security eats into profit margins. But with some lateral thinking it can actually improve the bottom line.
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September 14, 2017
Featured image - Silicon photonics

Silicon photonics moves out of the shadows

An alphabet soup of AI, HPC, 5G and the IoT has finally seeded creation of a design infrastructure for silicon photonics.
September 8, 2017

How HLS is giving shape to glasses-free 3DTV

High level synthesis (HLS) was adopted to realize innovative display IP as developed by a small core engineering team.
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