DFM

December 3, 2012

Overcoming dummy fill deck limitations for analog design

CSR used a customized approach to automated dummy fill layout for AMS to address layer density and device matching issues in standard flows aimed at digital SoCs.
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October 11, 2012
Tong Gao

The physical design challenges of 20nm processes

Manufacturability, routing, library design and more - it all needs rethinking at 20nm, writes Tong Gao of Synopsys.
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October 9, 2012
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Physical verification of 20nm designs through integrated double-patterning analysis and repair

Finding and fixing double patterning problems in 20nm designs
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September 12, 2012
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Critical tools for 20nm design

A look at the way in which key tools, in IC implementation, modeling and extraction, and physical verification, are developing in response to the challenges of 20nm design
September 6, 2012
Antun Domic

Getting ready for 20nm

Antun Domic of Synopsys tackles the three key challenges of 20nm processes: design complexity; the physics of lithography; and economics.
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August 21, 2012

2.5D-IC, 3D-IC, and 5.5D-IC – stacked-die integration

A guide to emerging 3D integration techniques for ICs, including a look at various approaches, and some of the tools and standards issues involved.
July 26, 2012
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Optimizing cloud computing for faster semiconductor design

How Cadence, Intel and Xuropa accelerated the semiconductor design process by squeezing 15% more capacity out of a virtualized server farm
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July 5, 2012
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Improving ASIC prototyping on multiple FPGAs through better partitioning

Using a new design-partitioning tool and stacked-silicon interconnect FPGA to develop an ASIC prototyping platform that can be reprogrammed several times a day.
June 1, 2012
Michael Buehler-Garcia

DAC 2012: 20(nm) questions

There's still debate over certain aspects of the 20nm node, but the main challenges are already being addressed. Expect to see foundries and vendors mark their turf at DAC.
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May 22, 2012
Jeff Wilson

Making dummy fill smarter

Guest blogger Jeff Wilson discusses some of the subtleties involved in the effective use of dummy fill in deep sub-micron IC designs.
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