Extracting finFET parasitics means a shift to 3D models, field solvers for greater accuracy, and MCMM techniques.
The costs of advanced lithography techniques at 1xnm, and the yield and reliability risks from the resultant process variation, will stop many companies getting the typical economic advantages of scaling.
PGA has been IC-centric for mainstream 2D configurations. It must become system-centric for 2.5D and 3D systems.
Electrically aware layout tools provide a more efficient alternative to time-consuming rip-up-and-retry practices in mixed-signal nanometer IC design.
New layout-dependent effects (LDEs) arise at each process node. This methodology updates LDE parameters and uses on-the-fly simulation for early detection.
Many design teams are looking at ways in which they can make use of 3D integration. Here are eight requirements for an effective 3D-IC design flow.
The arrival of the 20nm and finFET-based 14nm and 16nm processes bring with them challenges for custom IC design. These are the five key areas and a methodology that can address them.
It’s time to take up the challenge of applying 3D integration technology to IC design. The manufacturing process technology is maturing, the tool chains are in place, and the opportunities to broaden your market by applying a new form of systemic integration are growing.
You can waive some physical verification errors related to legacy IP found in foundry DRC checks. Knowing which has involved lengthy manual analysis. TSMC is enhancing the process with automation.
finFETs are vital to the next generation of CMOS processes from Intel, TSMC and others. How will process issues including bulk vs SOI substrates, density limitations, thickness control, and planar device integration affect their practical implementation?
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