DFM

December 1, 2005

IP protection under OASIS

Companies and mask shops already have plans and policies to secure the storage and transmission of sensitive layout VLSI data. These include confidentiality and non-disclosure agreements, and encryption. However, traditional VLSI file formats such as GDSII never popularized the type of constructs that facilitate intellectual property (IP) protection. The OASIS format does have these constructs. […]

December 1, 2005

DFM will change the industry’s business models

Introduction As semiconductor manufacturing moves into the sub-100nm realm, the need for increased cooperation and communication between design and manufacturing becomes more apparent. Manufacturing is becoming increasingly complex, and many of the principles that have guided design and manufacturing no longer apply. Some of the major changes occurring in wafer manufacturing include: The industry is […]

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December 1, 2005

Applying some perspective to DFM

So far, the debate over design for manufacturing (DFM) has featured contributions from, principally, four groups: designers, manufacturers, EDA vendors and the consultancy community. It is becoming increasingly apparent that some other voices need to be heard and their positions integrated within any successful semiconductor DFM chain. One such group is fab equipment suppliers. The […]

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December 1, 2005

Meeting yield enhancement challenges

Nanometer scaling severely inhibits the path to achieve sustainable yield. In response more responsibility for forecasting potential failures must shift to design for manufacturing (DFM) methodologies that can be applied early in the design process. Yet, while these hold much promise, manufacturing test and failure analysis remains at the forefront of determining why chips fail. […]

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June 1, 2005

Innovate in volume

If one thing has become clear as process geometries have gone below one micron, it is that the traditional development model is broken. It seems only recently that companies were talking about adopting a greater ‘customer focus’, but even the linear sequence of first, finding out what the client wants; second, getting your designers to […]

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June 1, 2005

A methodology of integrated post tape-out flow for fast design to mask TAT

Semiconductor devices are being fabricated with features that are less than half the wavelength of the available lithography exposure tools. Increasing circuit density has improved the complexity and performance of ICs but also led to serious patterning proximity effects. These effects make the chips almost impossible to fabricate without optical proximity correction (OPC) technology. Thus, […]

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June 1, 2005

Achieving better DFM: EDA tools pave the way to improved yield

Major yield-Inhibiting Issues At each successive process node, additional defect mechanisms appear and hinder the ability to achieve desired yield (Figure 1). The trend toward declining yields has led to a resurgence in the application of design for manufacturing (DFM) methodologies.Much of this reinvigorated effort relies heavily on a new breed of tools and technologies. […]

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June 1, 2005

The whole picture

Once upon a time, placing even the smallest question mark next to Moore’s Law was seen as something beyond heresy. Today, more and more people are voicing such thoughts in the mainstream. One of the most senior figures speaking out is Bernard Meyerson, vice president and chief technologist of IBM’s Systems & Technology Group. The […]

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