How to address increasingly complex patterning issues and debug them efficiently as design moves toward 12 and 10nm.
Diagnosis-driven yield analysis identifies the cause of systematic yield loss to speed the ramp-to-volume on new processes and improve yield on mature ones.
An alphabet soup of AI, HPC, 5G and the IoT has finally seeded creation of a design infrastructure for silicon photonics.
Pattern-based design/technology co-optimization (DTCO) estimates lithographic difficulty during the early stages of a new process technology node.
Our extended fireside chat with Mentor Chairman and CEO Wally Rhines begins by canvassing his thoughts now the Siemens deal is done.
The equipment giant's Computational Process Control strategy takes a pragmatic approach to Industry 4.0 and is likely to influence EDA tools for incoming nodes.
Multi-patterning, finFETs and more are forcing more detailed overhauls of P&R software at each process node. We dig into some of the key new issues and how they are being addressed.
AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
John Sturtevant looks at ongoing preparations for the incoming node and charts significant progress that has already been made.
Precise curved geometries are vital to making this emerging and cost-effective CMOS-based technology work. This primer explains its advantages and how litho tools are evolving to meet the challenges it presents.
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