Many design teams are looking at ways in which they can make use of 3D integration. Here are eight requirements for an effective 3D-IC design flow.
The arrival of the 20nm and finFET-based sub-20nm processes bring with them challenges for custom IC design. These are the five key areas and a methodology that can address them.
It’s time to take up the challenge of applying 3D integration technology to IC design. The manufacturing process technology is maturing, the tool chains are in place, and the opportunities to broaden your market by applying a new form of systemic integration are growing.
You can waive some physical verification errors related to legacy IP found in foundry DRC checks. Knowing which has involved lengthy manual analysis. TSMC is enhancing the process with automation.
finFETs are vital to the next generation of CMOS processes from Intel, TSMC and others. How will process issues including bulk vs SOI substrates, density limitations, thickness control, and planar device integration affect their practical implementation?
CSR used a customized approach to automated dummy fill layout for AMS to address layer density and device matching issues in standard flows aimed at digital SoCs.
The advantages and challenges of 3D IC integration, as we add vertical functional integration options to the traditional planar integration brought by the progress of Moore's Law.
Manufacturability, routing, library design and more - it all needs rethinking at 20nm, writes Tong Gao of Synopsys.
Finding and fixing double patterning problems in 20nm designs
A look at the way in which key tools, in IC implementation, modeling and extraction, and physical verification, are developing in response to the challenges of 20nm design
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