DFM

February 8, 2019
Featured image - Layout merging feature

Fast, accurate layout merging for SoC flows

How to achieve efficient merging of data from formats such as OASIS, GDS, and OpenAccess to ensure timely verification through DRC runs.
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December 31, 2018
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Enhanced model-based hinting may be the edge you need below 20nm

A detailed dive into how MBH strategies for litho hotspots have been enhanced to deal with double patterning at 20nm and below.
September 11, 2018
Gandharv Bhatara is the product marketing manager for the Calibre OPC/RET products at Mentor, a Siemens Business.

EUV’s arrival demands a new resolution enhancement flow

Gandharv Bhatara looks at how the OPC and RET elements of Calibre are getting ready for the EUV age.
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August 13, 2018
Dina Medhat is a Technical Lead for Calibre Design Solutions at Mentor, a Siemens Business. She has held a variety of product and technical marketing roles at the company, and received her BS and MS degrees from Ain Shames University in Cairo, Egypt. She is currently a PhD student at Ain Shames University.

Managing waivers in reliability verification

Dina Medhat describes what you need to know about the types of waiver strategy that can be applied.
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May 31, 2018
layout file feature

Layout-database file control: the missing link

The authors descirbe a new signature-based approach to resolving the content of layouts in GDSII, OASIS and other formats.
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April 23, 2018
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The three critical data validation points in a design flow

Why design data integrity matters from cell design to tapeout. These techniques will help ensure your validation process is as comprehensive as possible.
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April 17, 2018
Guido Groeseneken is an Imec fellow, researching advanced devices and the reliability physics of sub-10nm CMOS technologies.

Reliability research helps to create new technologies

Insights from research into reliability at Imec led to self-learning chips, security technologies, and finFET biosensors.
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March 29, 2018
Two wafers fabbed at Imec

3DIC technology provides performance boosts

3D integration technology has split into a number of different approaches, each of which brings a different combination of benefits in terms of performance.
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February 1, 2018
Design space exploration feature

Design space exploration finds hotspots during early process development

A new technique has been developed to catch potential new lithography issues when little design data is available for incoming nodes.
January 15, 2018
Physical Verification Efficiencies - featured image

Three ways to lift productivity during physical verification

How to get the best PV results by reducing computational demands; handling data more efficiently and exploiting parallelization.
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