3D-IC design is ready for take-off, following several years of intense collaboration to develop the necessary tools, methodologies and flows
Formal verification techniques are becoming more widely used as the size and complexity of SoCs and increases.
Clock domain crossing bugs undermine the productivity gains of moving to block-based design, but can be tackled through hierarchical formal analysis.
RTL sign-off strategies ease SoC design and IP integration by enabling early analysis and optimization of CDC, power, X propagation, timing, and resetability issues.
Better upfront analysis can help avoid propagating errors from RTL into the netlist, and reveal a number of ways to improve the quality of your final design.
Many problems arise during the IP-to-SoC phase of FPGA-based prototyping due to the mix-and-match nature of the prototypes not the actual designs.
It’s time to take up the challenge of applying 3D integration technology to IC design. The manufacturing process technology is maturing, the tool chains are in place, and the opportunities to broaden your market by applying a new form of systemic integration are growing.
An increasingly important concept in design is that of product creation. An approach based on product creation looks beyond chip or board design.
Debug of logic and testbench debug makes up 35% of chip design, and is growing as power-management and hardware/software issues become part of the task.
How should you quiz your verification IP vendor to get the right VIP for your needs? Synopsys' Neill Mullinger details a checklist of the key points to raise.
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