USB 3.0

September 18, 2015
Featured image: PHY VIP Sep 15

How PHY verification kits overcome traditional VIP limitations

Established physical layer verification IP packages focus so much on protocols they miss problems that arise from the broader context. A PHY verification kit bridges the gap.
Article  |  Topics: IP - Assembly & Integration, EDA - Verification  |  Tags: , , , , , , ,   |  Organizations:
August 26, 2015
Gervais Fong is a senior product manager for mixed-signal PHY IP at Synopsys.

USB Type-C: easier for users, harder for designers

Implementing the reversible connector of USB Type-C demands a rethink of the PHY architecture to achieve the most cost-effective IP solution
Expert Insight  |  Topics: IP - Selection  |  Tags: , , , ,   |  Organizations:
July 14, 2015
John Blyler is an experienced physicist, engineer, journalist, author and professor, and editor of IoT Embedded Systems

USB Type-C: what it is and why it matters

A look at the USB Type-C connector and the enhanced data rates and charging facilities it will enable
Expert Insight  |  Topics: Embedded - Architecture & Design  |  Tags: , , , ,   |  Organizations:
October 23, 2013
xilinx Virtex 3dic fpga feat

FPGA-based prototyping to validate the integration of IP into an SoC

A case study describing validation of the integration of USB3.0 and USB2.0 interface IP that illustrates broader challenges FPGA-based prototyping presents.
Article  |  Topics: IP - Assembly & Integration, EDA - Verification  |  Tags: , ,   |  Organizations:
September 16, 2013
SuperSpeed_USBLogo - feat

Why use USB 3.0?

The first of a series of seven articles describing the key details of the USB 3.0 protocol.
Article  |  Topics: IP - Selection  |  Tags: ,   |  Organizations:
September 16, 2013

The USB 3.0 Link Layer

A look at the way in which the USB 3.0 Link Layer manages the port-to-port flow of data between the host and the device.
Article  |  Topics: IP - Assembly & Integration  |  Tags: ,   |  Organizations:
September 16, 2013

USB 3.0 system overview

An overview of the USB 3.0 architecture, covering the USB Host, USB Device(s) and USB Interconnect, as well as the related receptacles, plugs and cables.
Article  |  Topics: IP - Assembly & Integration  |  Tags: ,   |  Organizations:
September 16, 2013

USB 3.0 protocol layer – part 1

A first look at the role of the protocol layer in USB 3.0.
Article  |  Topics: IP - Assembly & Integration  |  Tags: , ,   |  Organizations:
September 16, 2013
SuperSpeed_USBLogo - feat

The USB 3.0 Functional Layer

A look at the USB 3.0 functional layer, an application layer and system software on the host side, and a logical function and device on the device side.
Article  |  Topics: IP - Assembly & Integration  |  Tags: , ,   |  Organizations:
September 16, 2013

USB 3.0 protocol layer – part 2

A look at the role of four types of transaction in the USB 3.0 protocol layer: bulk, control, interrupt and isochronous.
Article  |  Topics: IP - Assembly & Integration  |  Tags: , ,   |  Organizations:

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