BCI-ROM: a game-changer for electro-thermal design
The Boundary Condition Independent Reduced Order Model (BCI-ROM) provides vital help in addressing growing electro-thermal challenges in SPICE simulation.
thermal analysis
Cooling power electronics at room level
German consultancy E-Cooling describes its strategy for thermal and airflow analysis.
The Wally Rhines interview – Part One: Mentor as a Siemens business
Our extended fireside chat with Mentor Chairman and CEO Wally Rhines begins by canvassing his thoughts now the Siemens deal is done.
A reliability checklist for the Connected World
Reliability is growing to match security as a key challenge for PCB design. These tools and techniques will help you rise to it.
Noise and manufacturing concerns control design for power-module makers
Keeping noise levels down was one of the priorities for two companies working independently on configurable power supplies – but without compromising DFM and thermal performance.
The future of thermal simulation for electronics products
Complexity and the increasing use of thermal analysis software by non-expert designers demands new approaches for chip and PCB implementations.
Inside the hot zone
Floorplanning informed by thermal analysis can significantly improve PCB layouts, writes Robin Bornoff The number of PCB design constraints seems ever increasing. The risk that a design will fail either functional performance or reliability goals grows for each generation. One increasingly popular trade-off addresses a balance between thermal compliance and signal integrity. Components with high […]
PLATINUM SPONSORS
View All Sponsors