Moore’s Law

November 24, 2017
John Ferguson is the Director of Marketing for Calibre DRC Applications at Mentor, a Siemens Business, in Wilsonville, Oregon, with extensive experience in physical design verification. He holds a BS degree in Physics from McGill University, an MS in Applied Physics from the University of Massachusetts, and a PhD in Electrical Engineering from the Oregon Graduate Institute of Science and Technology.

Assessing the true cost of node transitions

John Ferguson reviews the key capital metrics you need to review when deciding whether to move to a new process.
April 26, 2016
Andrew Macleod is Director of Automotive Marketing for Mentor Graphics. He has more than 15 years of experience in the automotive software and semiconductor industry, with expertise in new product development and introduction, product management and global strategy, including a focus on the Chinese auto industry.

Still using Moore’s Law to beat up on the automotive industry?

These days, when it comes to innovation: The car's the star - not the stooge.
Expert Insight  |  Topics: EDA - IC Implementation, Embedded - Platforms  |  Tags: , , , ,   |  Organizations:
June 22, 2014
Preview image for monolithic 3D integration

Monolithic 3DIC for SoC

Monolithic 3DIC integration may provide a viable alternative to conventional 2D scaling for SoCs if manufacturing problems can be overcome.
December 3, 2013
Dr David M Fried is Chief Technology Officer - Semiconductor at Coventor, responsible for the company’s strategic direction and implementation of its SEMulator3D Virtual Fabrication Platform.

Lithography challenges threaten the cost benefits of IC scaling

The costs of advanced lithography techniques at 1xnm, and the yield and reliability risks from the resultant process variation, will stop many companies getting the typical economic advantages of scaling.
Expert Insight  |  Topics: EDA - DFM  |  Tags: , , , , , , , , ,   |  Organizations:
April 1, 2011

Migrating from single to multicore processing on QorIQ technology

The single core processor is reaching its performance ceiling, due to energy, thermal and power concerns. To address these issues that cause design difficulties, many embedded designers are migrating embedded applications from single core to multicore. This article provides an outline for a software strategy to progress from one core to two and beyond using [...]
Article  |  Topics: Embedded - Architecture & Design  |  Tags: , , ,   |  Organizations:

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