interposer

November 20, 2018
HDAP_FeaturedImage

Adding system-level, post-layout electrical analysis to HDAP design and verification

Adoption of high-density advanced packaging (HDAP) needs tools and supports to build designers' confidence in the emerging technology.
Article  |  Topics: EDA - IC Implementation, Verification  |  Tags: , , , , , ,   |  Organizations: , ,
April 8, 2014
Randall Myers is an Xpedition Flow technical marketing engineer at Mentor Graphics

Straighten up and fly right

Fighter pilots have long trusted highly sophisticated automation. That’s how you can meet the challenges posed by advanced PCB design techniques.
August 12, 2013
Steve Smith of Synopsys

Help Wanted? Help Given! 3D-IC design is ready for take-off

3D-IC design is ready for take-off, following several years of intense collaboration to develop the necessary tools, methodologies and flows
Expert Insight  |  Topics: EDA - IC Implementation  |  Tags: , , ,   |  Organizations: , ,

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