high-density interconnect

June 10, 2014
High-speed I/O eye diagram - thumbnail

Zeroing in on the problems of fast board-level interconnect

A panel session at DAC 2014 focused on the problems of high-speed, board-level interconnect and the roles of codesign and power integrity in solving them.
April 8, 2014
Randall Myers is an Xpedition Flow technical marketing engineer at Mentor Graphics

Straighten up and fly right

Fighter pilots have long trusted highly sophisticated automation. That’s how you can meet the challenges posed by advanced PCB design techniques.
November 1, 2008

The impact of HDI and microvias on PCB design

What impact do HDI via structures have on PCB design metrics? Andy Kowalewski describes a recent experiment. A PCB’s density has traditionally been seen as a function of the trace and space geometry and the number of signal layers. Emerging technologies such as microvias and buildup fabrication may force us to rethink this formula. In […]

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