high-density advanced packaging

November 20, 2018
HDAP_FeaturedImage

Adding system-level, post-layout electrical analysis to HDAP design and verification

Adoption of high-density advanced packaging (HDAP) needs tools and supports to build designers' confidence in the emerging technology.
Article  |  Topics: EDA - IC Implementation, Verification  |  Tags: , , , , , ,   |  Organizations: , ,

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