finFET

August 7, 2014
Hitendra Divecha is senior product marketing manager at Cadence Design Systems

Dealing with parasitic-extraction challenges in finFETs and advanced nodes

FinFET and 3DIC technologies bring with them not just higher performance but an increased need for accurate parasitic analysis.
Expert Insight  |  Topics: EDA - IC Implementation, Verification  |  Tags: , , ,   |  Organizations:
July 15, 2014

Parasitic extraction

Parasitic extraction reveals the impact of implementation on the theoretical performance of IC designs.
July 13, 2014
ST/CEA-Leti 'Frisbee' wide-voltage DSP

DVFS and body bias

Dynamic voltage and frequency scaling is effective for low-power VLSI design. Body or back bias can provide additional control over leakage and performance.
Guide  |  Topics: EDA - IC Implementation  |  Tags: , , , ,
July 9, 2014
Intel's trigate is among the structures to be modeled by the revised BSIM4

One BSIM to rule them all

A change in the way the core compact models are developed has accelerated their development and, for the first time, allowed the models to be used not just for circuit simulation but to help guide process evolution as chipmakers play not only with materials but the shape of finFETs.
Article  |  Topics: EDA - DFM, IC Implementation  |  Tags: , , , , , ,   |  Organizations: ,
June 22, 2014
Preview image for monolithic 3D integration

Monolithic 3DIC for SoC

Monolithic 3DIC integration may provide a viable alternative to conventional 2D scaling for SoCs if manufacturing problems can be overcome.
June 10, 2014
High-speed I/O eye diagram - thumbnail

Zeroing in on the problems of fast board-level interconnect

A panel session at DAC 2014 focused on the problems of high-speed, board-level interconnect and the roles of codesign and power integrity in solving them.
May 29, 2014
Near-threshold computing for minimum energy - thumbnail

Near-threshold and subthreshold logic

By taking the circuit supply voltage close to that of the threshold voltage or even below, it is possible to optimize low-power VLSI design. But there are pitfalls.
December 9, 2013
Carey Robertson is a director of product marketing at Mentor Graphics overseeing the marketing activities for layout versus schematic (LVS) and extraction products.

FinFET parasitics come under control

Extracting finFET parasitics means a shift to 3D models, field solvers for greater accuracy, and MCMM techniques.
Expert Insight  |  Topics: EDA - DFM, IC Implementation  |  Tags: , , , ,   |  Organizations:
December 3, 2013
Dr David M Fried is Chief Technology Officer - Semiconductor at Coventor, responsible for the company’s strategic direction and implementation of its SEMulator3D Virtual Fabrication Platform.

Lithography challenges threaten the cost benefits of IC scaling

The costs of advanced lithography techniques at 1xnm, and the yield and reliability risks from the resultant process variation, will stop many companies getting the typical economic advantages of scaling.
Expert Insight  |  Topics: EDA - DFM  |  Tags: , , , , , , , , ,   |  Organizations:
May 29, 2013
FinFET capacitances diagram

How to design with finFETs

How to design with finFETs, including the impact on standard cells, IP, SRAM; the effects of fin quantization; extraction and parasitics; AMS issues and more.

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