DRAM

September 23, 2015

Mounting Fiji: How AMD realized the first volume interposer

AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
Article  |  Topics: EDA - DFM, DFT, IC Implementation  |  Tags: , , , , , , ,   |  Organizations: , , , ,
May 30, 2014

How the right DFY flow enhances performance and profit

'Design for yield' is a familiar term, but the challenges in today's increasingly large projects make a refresher on what it offers particularly timely.
Article  |  Topics: EDA - DFM, IC Implementation  |  Tags: , , , , ,   |  Organizations:
September 24, 2013
Hybrid memory cube architecture

DRAM interfaces for mobile and networking designs

Mobile and networking platforms need high bandwidth, low power consumption, and small footprint. These needs drove standards, such as LPDDR4, Wide I/O 2 and Hybrid Memory Cube.
Article  |  Topics: IP - Selection  |  Tags: , , , , , , ,   |  Organizations:

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