advanced packaging

September 23, 2015
amd-semitai-featim

Mounting Fiji: How AMD realized the first volume interposer

AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
Article  |  Topics: EDA - DFM, DFT, IC Implementation  |  Tags: , , , , , , ,   |  Organizations: , , , ,
July 25, 2014
Bundles help group signals on package pinouts

Multi-fabric planning for more efficient PCB design

A coordinated design methodology fine-tunes chip-to-package PCB layout and routing that involves high-integration devices.
June 10, 2014
High-speed I/O eye diagram - thumbnail

Zeroing in on the problems of fast board-level interconnect

A panel session at DAC 2014 focused on the problems of high-speed, board-level interconnect and the roles of codesign and power integrity in solving them.
January 16, 2012

Mechanical CAD integration

MCAD integration provides the means for designers to test the mechanical compatibility of a PCB design – for cooling performance as well as whether the layout will fit into an enclosure without problems.
Guide  |  Topics: PCB - System Codesign  |  Tags: , , , ,

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