3DIC – the advantages and the challenges of vertical integration
The advantages and challenges of 3D IC integration, as we add vertical functional integration options to the traditional planar integration brought by the progress of Moore's Law.
5.5DIC
2.5D-IC, 3D-IC, and 5.5D-IC – stacked-die integration
A guide to emerging 3D integration techniques for ICs, including a look at various approaches, and some of the tools and standards issues involved.
PLATINUM SPONSORS
View All Sponsors