5.5DIC

November 16, 2012
Marco Casale-Rossi

3DIC – the advantages and the challenges of vertical integration

The advantages and challenges of 3D IC integration, as we add vertical functional integration options to the traditional planar integration brought by the progress of Moore's Law.
Expert Insight  |  Topics: EDA - IC Implementation  |  Tags: , , ,   |  Organizations: , , ,
August 21, 2012

2.5D-IC, 3D-IC, and 5.5D-IC – stacked-die integration

A guide to emerging 3D integration techniques for ICs, including a look at various approaches, and some of the tools and standards issues involved.

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