3DIC

NAND flash is a key technology for all systems. 3D techniques now control its cost and potential for future capacity increases.

Parasitic extraction reveals the impact of implementation on the theoretical performance of IC designs.

Monolithic 3DIC integration may provide a viable alternative to conventional 2D scaling for SoCs if manufacturing problems can be overcome.

A guide to emerging 3D integration techniques for ICs, including a look at various approaches, and some of the tools and standards issues involved.