3DIC

3D-IC presents major connectivity challenges in maintaining a golden netlist and managing necessary exceptions. Learn how to manage them.

3D integration technology has split into a number of different approaches, each of which brings a different combination of benefits in terms of performance.

AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?

Innovation in physical verification is driven by incoming nodes but new tools and features can and should be fed back up the technology chain.

FinFET and 3DIC technologies bring with them not just higher performance but an increased need for accurate parasitic analysis.

How to enhance an 'ideal' parastitic extraction strategy to create a full 3D assembly-level parasitic netlist for simulation and circuit analysis.

Fighter pilots have long trusted highly sophisticated automation. That’s how you can meet the challenges posed by advanced PCB design techniques.

PGA has been IC-centric for mainstream 2D configurations. It must become system-centric for 2.5D and 3D systems.

Mobile and networking platforms need high bandwidth, low power consumption, and small footprint. These needs drove standards, such as LPDDR4, Wide I/O 2 and Hybrid Memory Cube.

3D-IC design is ready for take-off, following several years of intense collaboration to develop the necessary tools, methodologies and flows