20nm

November 24, 2017
John Ferguson is the Director of Marketing for Calibre DRC Applications at Mentor, a Siemens Business, in Wilsonville, Oregon, with extensive experience in physical design verification. He holds a BS degree in Physics from McGill University, an MS in Applied Physics from the University of Massachusetts, and a PhD in Electrical Engineering from the Oregon Graduate Institute of Science and Technology.

Assessing the true cost of node transitions

John Ferguson reviews the key capital metrics you need to review when deciding whether to move to a new process.
October 27, 2017
Featured image - double patterning at advanced nodes

Catch multi-patterning errors clearly at advanced nodes

How to address increasingly complex patterning issues and debug them efficiently as design moves toward 12 and 10nm.
Article  |  Topics: EDA - DFM, - EDA Topics, EDA - Verification  |  Tags: , , , , , ,   |  Organizations:
July 23, 2014

20nm

The 20nm node can offer power, performance and area advantages, but making these gains takes a deep understanding of the interactions between process and design.
January 13, 2014
Interconnect resistance has increased since the 40nm node

Interconnect resistance

A number of effects have led to a dramatic increase in interconnect resistance in the sub-32nm process nodes that demands the use of smarter routing.
October 8, 2013
Cadence EAD flow

End mixed-signal infinite loops with electrically aware design

Electrically aware layout tools provide a more efficient alternative to time-consuming rip-up-and-retry practices in mixed-signal nanometer IC design.
August 25, 2013
Tim Whitfield, director of engineering, ARM Taiwan

Proving the 20nm ecosystem with the ARM Mali GPU

What ARM learnt when it ran a Mali GPU-based test chip through a Synopsys tool flow onto a TSMC 20nm process
April 22, 2013
Layout segment showing problem of color splitting with double patterning

The five key challenges of sub-28nm custom and analog design

The arrival of the 20nm and finFET-based 14nm and 16nm processes bring with them challenges for custom IC design. These are the five key areas and a methodology that can address them.
December 6, 2012

20nm timing analysis – a practical and scalable approach

Using hierarchy and improved constraints management to accelerate static timing analysis at 20nm and below.
Article  |  Topics: EDA Topics, EDA - IC Implementation  |  Tags: , , , ,   |  Organizations:
December 4, 2012
Dr David M Fried is Chief Technology Officer - Semiconductor at Coventor, responsible for the company’s strategic direction and implementation of its SEMulator3D Virtual Fabrication Platform.

FinFET tipsheet for IEDM

finFETs are vital to the next generation of CMOS processes from Intel, TSMC and others. How will process issues including bulk vs SOI substrates, density limitations, thickness control, and planar device integration affect their practical implementation?
Expert Insight  |  Topics: EDA - DFM  |  Tags: , , , , , , , , ,   |  Organizations:
November 5, 2012
20nm test feature image

20nm test demands new design-for-test and diagnostic strategies

20nm test needs new approaches to cope with short delay defects, new memory failure mechanisms and the consequences of test compression strategies
Article  |  Topics: EDA - DFT  |  Tags: , , , ,   |  Organizations: , ,

PLATINUM SPONSORS

Synopsys Cadence Design Systems Mentor - A Siemens Business
View All Sponsors