2.5DIC

April 8, 2014
Randall Myers is an Xpedition Flow technical marketing engineer at Mentor Graphics

Straighten up and fly right

Fighter pilots have long trusted highly sophisticated automation. That’s how you can meet the challenges posed by advanced PCB design techniques.
October 11, 2013
Mentor Power Grid article featured image

Power grid analysis for 2.5D and 3D IC systems

PGA has been IC-centric for mainstream 2D configurations. It must become system-centric for 2.5D and 3D systems.
Article  |  Topics: EDA - DFM, IC Implementation  |  Tags: , , ,   |  Organizations:
August 12, 2013
Steve Smith of Synopsys

Help Wanted? Help Given! 3D-IC design is ready for take-off

3D-IC design is ready for take-off, following several years of intense collaboration to develop the necessary tools, methodologies and flows
Expert Insight  |  Topics: EDA - IC Implementation  |  Tags: , , ,   |  Organizations: , ,
May 8, 2013
3D-IC cross-section

Eight requirements for 3D-IC design

Many design teams are looking at ways in which they can make use of 3D integration. Here are eight requirements for an effective 3D-IC design flow.
Article  |  Topics: EDA - DFM, IC Implementation  |  Tags: , ,   |  Organizations:
April 17, 2013
Xilinx 3D-IC interposer featured image

3D-IC integration – a stepwise approach

2.5D-IC integration overcomes 2D limitations such as cost, offchip bandwidth bottlenecks and I/O pin scarcity, and offers a route to true 3D-IC integration.
Article  |  Topics: EDA - IC Implementation  |  Tags: , ,   |  Organizations:
April 10, 2013
Marco Casale-Rossi is a senior staff product marketing manager in the Design Group at Synopsys.

Time to take up the 3D integration challenge

It’s time to take up the challenge of applying 3D integration technology to IC design. The manufacturing process technology is maturing, the tool chains are in place, and the opportunities to broaden your market by applying a new form of systemic integration are growing.
Expert Insight  |  Topics: EDA - DFM, IC Implementation  |  Tags: , , ,   |  Organizations:
December 12, 2012
Xilinx 3D-IC interposer featured image

Enabling 3D-IC design

Meeting the challenges of moving beyond planar integration to side by side, and eventually truly stacked, dice, for designers, tool vendors and the supply chain.
Article  |  Topics: EDA - IC Implementation  |  Tags: , , ,   |  Organizations: ,
November 16, 2012
Marco Casale-Rossi

3DIC – the advantages and the challenges of vertical integration

The advantages and challenges of 3D IC integration, as we add vertical functional integration options to the traditional planar integration brought by the progress of Moore's Law.
Expert Insight  |  Topics: EDA - IC Implementation  |  Tags: , , ,   |  Organizations: , , ,
August 21, 2012

2.5D-IC, 3D-IC, and 5.5D-IC – stacked-die integration

A guide to emerging 3D integration techniques for ICs, including a look at various approaches, and some of the tools and standards issues involved.

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