10nm

October 27, 2017
Featured image - double patterning at advanced nodes

Catch multi-patterning errors clearly at advanced nodes

How to address increasingly complex patterning issues and debug them efficiently as design moves toward 12 and 10nm.
Article  |  Topics: EDA - DFM, - EDA Topics, EDA - Verification  |  Tags: , , , , , ,   |  Organizations:
March 22, 2017
Computational Process Control feature

How Applied Materials and fab partners are harnessing machine learning

The equipment giant's Computational Process Control strategy takes a pragmatic approach to Industry 4.0 and is likely to influence EDA tools for incoming nodes.
January 4, 2016
Interconnect variation in SoC

Timing analysis shifts to statistical

The 10nm process node calls for the use of SOCV techniques during timing signoff to avoid leaving too much performance on the table.
November 26, 2015
Cadence mask coloring assistant

Mixed-signal designs prepare for coloring at 10nm

The arrival of the 10nm process will impact the way that designers approach custom and mixed-signal layout. Cadence Design Systems has made changes to its Virtuoso environment that deploy increased automation support and electrically-aware layout to deal with the upcoming issues.
October 29, 2015
Innovus chip layout

Cadence’s path to digital implementation on 10nm

The 10nm process will see changes to multiple patterning that demands changes in the implementation flow, along with an increased focus on the effects of variability.
March 26, 2015
10nm lithography progress

A review of model development for 10nm lithography

John Sturtevant looks at ongoing preparations for the incoming node and charts significant progress that has already been made.
Article  |  Topics: EDA - DFM  |  Tags: , ,   |  Organizations: , ,
February 11, 2014
Mark Bollar is a product marketing director at Synopsys overseeing physical implementation.

The new landscape of advanced design

Advanced tools are being applied to established nodes to produce advanced designs for volume markets.
January 20, 2014
Jean-Marie Brunet is the Product Marketing Director for DFM at Mentor Graphics

Patterning choices loom for 10nm and beyond

It is not just a choice between EUV and multiple patterning for future nodes, but even between varieties of multi-mask technologies. How will you decide?
December 3, 2013
Dr David M Fried is Chief Technology Officer - Semiconductor at Coventor, responsible for the company’s strategic direction and implementation of its SEMulator3D Virtual Fabrication Platform.

Lithography challenges threaten the cost benefits of IC scaling

The costs of advanced lithography techniques at 1xnm, and the yield and reliability risks from the resultant process variation, will stop many companies getting the typical economic advantages of scaling.
Expert Insight  |  Topics: EDA - DFM  |  Tags: , , , , , , , , ,   |  Organizations:

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