August 21, 2012
A guide to emerging 3D integration techniques for ICs, including a look at various approaches, and some of the tools and standards issues involved.
March 28, 2012
It may be necessary to move to three-dimensional 'FinFET' transistors for future process nodes, but what impact will this have on circuit design?
March 28, 2012
Fully depleted silicon on insulator (FD-SOI) transistor architectures may offer speed and power advantages, at the cost of a shift to non-standard substrates.
January 16, 2012
Double patterning provides an alternative to using EUV lithography – making it possible to implement ICs on sub-28nm processes.
January 16, 2012
MCAD integration provides the means for designers to test the mechanical compatibility of a PCB design – for cooling performance as well as whether the layout will fit into an enclosure without problems.
January 15, 2012
Virtualization makes it possible to run multiple operating system images on one processor core – with benefits for memory protection, power efficiency and cost reduction.