Guides - Technologies

August 21, 2012

2.5D-IC, 3D-IC, and 5.5D-IC – stacked-die integration

A guide to emerging 3D integration techniques for ICs, including a look at various approaches, and some of the tools and standards issues involved.
March 28, 2012

FinFETs

It may be necessary to move to three-dimensional 'FinFET' transistors for future process nodes, but what impact will this have on circuit design?
March 28, 2012

FD-SOI

Fully depleted silicon on insulator (FD-SOI) transistor architectures may offer speed and power advantages, at the cost of a shift to non-standard substrates.
January 16, 2012

Double patterning for sub-28nm ICs

Double patterning provides an alternative to using EUV lithography – making it possible to implement ICs on sub-28nm processes.
Guide  |  Topics: EDA - DFM  |  Tags: , , ,
January 16, 2012

Mechanical CAD integration

MCAD integration provides the means for designers to test the mechanical compatibility of a PCB design – for cooling performance as well as whether the layout will fit into an enclosure without problems.
Guide  |  Topics: PCB - System Codesign  |  Tags: , , , ,
January 15, 2012

Virtualization

Virtualization makes it possible to run multiple operating system images on one processor core – with benefits for memory protection, power efficiency and cost reduction.

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