Guides - Technologies

June 18, 2017

Portable stimulus

Accellera's Portable Stimulus standard aims to improve verification efficiency and the reuse of test IP across the entire design life cycle.
July 23, 2014

20nm

The 20nm node can offer power, performance and area advantages, but making these gains takes a deep understanding of the interactions between process and design.
July 13, 2014
ST/CEA-Leti 'Frisbee' wide-voltage DSP

DVFS and body bias

Dynamic voltage and frequency scaling is effective for low-power VLSI design. Body or back bias can provide additional control over leakage and performance.
Guide  |  Topics: EDA - IC Implementation  |  Tags: , , , ,
June 22, 2014
Preview image for monolithic 3D integration

Monolithic 3DIC for SoC

Monolithic 3DIC integration may provide a viable alternative to conventional 2D scaling for SoCs if manufacturing problems can be overcome.
May 29, 2014

Lint

A static-analysis tool that checks for errors in HDL code, lint is becoming an increasingly important addition to simulation for RTL and SoC signoff.
Guide  |  Topics: EDA - Verification  |  Tags: , , , , , ,
May 28, 2014

Formal verification

As designs get larger and stress the ability of simulation to exercise an SoC, formal techniques have become essential parts of design and verification.
May 26, 2014
Unidirectionally routed M1 using SADP (Source: CMU/IBM)

Triple patterning and self-aligned double patterning (SADP)

In the absence of EUV lithography, the primary option for manufacturing on a 10nm process is to extend double patterning. But the options each have issues.
May 19, 2014

10nm processes

The 10nm generation is the follow-on process to the 14nm/16nm node and will provide a choice of either finFET or planar FD-SOI architectures. But the likely absence of EUV will increase costs.
May 19, 2014

14nm/16nm processes

The 14nm and 16nm processes cover a range of technologies and are designed to succeed the 20nm generation. They bring with them a number of design challenges.
August 21, 2012

2.5D-IC, 3D-IC, and 5.5D-IC – stacked-die integration

A guide to emerging 3D integration techniques for ICs, including a look at various approaches, and some of the tools and standards issues involved.

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