A detailed dive into how MBH strategies for litho hotspots have been enhanced to deal with double patterning at 20nm and below.
John Ferguson reviews the key capital metrics you need to review when deciding whether to move to a new process.
AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
Moving to a finFET process means considering process readiness, cost and yield, as well as the traditional power, performance and area advantages
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