TSMC

November 24, 2017
John Ferguson is the Director of Marketing for Calibre DRC Applications at Mentor, a Siemens Business, in Wilsonville, Oregon, with extensive experience in physical design verification. He holds a BS degree in Physics from McGill University, an MS in Applied Physics from the University of Massachusetts, and a PhD in Electrical Engineering from the Oregon Graduate Institute of Science and Technology.

Assessing the true cost of node transitions

John Ferguson reviews the key capital metrics you need to review when deciding whether to move to a new process.
September 14, 2017
Featured image - Silicon photonics

Silicon photonics moves out of the shadows

An alphabet soup of AI, HPC, 5G and the IoT has finally seeded creation of a design infrastructure for silicon photonics.
March 22, 2017
Computational Process Control feature

How Applied Materials and fab partners are harnessing machine learning

The equipment giant's Computational Process Control strategy takes a pragmatic approach to Industry 4.0 and is likely to influence EDA tools for incoming nodes.
November 29, 2016
Ken Brock, product marketing manager, Synopsys

Six ways to exploit the advantages of finFETs

FinFET processes and libraries are maturing, enabling designers to explore the best ways to take advantage of the capabilities of the new transistor design
Expert Insight  |  Topics: EDA - IC Implementation, IP - Selection  |  Tags: , , ,   |  Organizations: ,
October 29, 2015
Innovus chip layout

Cadence’s path to digital implementation on 10nm

The 10nm process will see changes to multiple patterning that demands changes in the implementation flow, along with an increased focus on the effects of variability.
July 20, 2015
TSMC finFET

Lessons learned in the finFET trenches

In sessions at the 2015 Design Automation Conference, engineers who had worked on finFET-oriented projects revealed how the technology has changed their design practices and where others may want to think twice about making the move.
October 6, 2014
Power grid signal track blocking

ARM, TSMC design explores 16nm finFET issues

ARM and TSMC used an extensive pre-planning process, including a static analysis of each module's overall logic structure, to put together a 2.3GHz processor design based around ARM's main 64bit Big.Little pairing for the foundry's 16nm finFET process.
Article  |  Topics: EDA - IC Implementation  |  Tags: , , , , ,   |  Organizations: ,
September 18, 2014
Moores Cores - featimg

Using optimized design flows to meet PPA goals for SoC processor cores

How tuning a design flow can help optimize SoC processor cores for power, performance and area - and make it possible to do different optimisations for different cores on the same SoC.
September 2, 2014
Intel's trigate is among the structures to be modeled by the revised BSIM4

Design enablement and entitlement for 14/16nm finFET processes

How EDA tools are evolving to make it possible to design with finFET processes.
Article  |  Topics: EDA - IC Implementation  |  Tags: , , , ,   |  Organizations: , ,
August 27, 2014
Prasad Saggurti is the product marketing manager for embedded memory IP at Synopsys.

Six key criteria for deciding to migrate to a finFET process

Moving to a finFET process means considering process readiness, cost and yield, as well as the traditional power, performance and area advantages
Expert Insight  |  Topics: EDA - IC Implementation, IP - Selection  |  Tags: , ,   |  Organizations: , , , , ,

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