The advantages and challenges of 3D IC integration, as we add vertical functional integration options to the traditional planar integration brought by the progress of Moore's Law.
20nm test needs new approaches to cope with short delay defects, new memory failure mechanisms and the consequences of test compression strategies
Manufacturability, routing, library design and more - it all needs rethinking at 20nm, writes Tong Gao of Synopsys.
Finding and fixing double patterning problems in 20nm designs
A look at the way in which key tools, in IC implementation, modeling and extraction, and physical verification, are developing in response to the challenges of 20nm design
Antun Domic of Synopsys tackles the three key challenges of 20nm processes: design complexity; the physics of lithography; and economics.
Mentor’s Dennis Brophy, Cadence’s Stan Krolikoski and Synopsys’ Yatin Trivedi describe how you can prepare to adopt Accellera’s Universal Verification Methodology.
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