2.5D-IC integration overcomes 2D limitations such as cost, offchip bandwidth bottlenecks and I/O pin scarcity, and offers a route to true 3D-IC integration.
It’s time to take up the challenge of applying 3D integration technology to IC design. The manufacturing process technology is maturing, the tool chains are in place, and the opportunities to broaden your market by applying a new form of systemic integration are growing.
Debug of logic and testbench debug makes up 35% of chip design, and is growing as power-management and hardware/software issues become part of the task.
Now companies in any tier can use development kits as a platform to speed development, bridge the hardware-software divide and build out ecosystems quickly.
The technique drove ‘agile systems development’ for the programmable logic vendor’s new product line.
Cache coherency implemented in hardware increases the verification effort. VIP-based strategies are described with particular reference to ARM protocols.
How should you quiz your verification IP vendor to get the right VIP for your needs? Synopsys' Neill Mullinger details a checklist of the key points to raise.
Meeting the challenges of moving beyond planar integration to side by side, and eventually truly stacked, dice, for designers, tool vendors and the supply chain.
Using hierarchy and improved constraints management to accelerate static timing analysis at 20nm and below.
The business case behind how virtual prototyping speeds development, improves hardware and software quality, and improves ROI.
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