SK Hynix

January 9, 2018

Choosing between DDR4 and HBM in memory-intensive applications

Exploring the tradeoffs between implementing DDR4 and HBM for high-bandwidth memory subsystems.

Article | Topics: Embedded - Architecture & Design, IP - Selection | Tags: DDR4, HBM, HBM2 | Organizations: AMD, JEDEC, SK Hynix, Synopsys

September 23, 2015

Mounting Fiji: How AMD realized the first volume interposer

AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?

Article | Topics: EDA - DFM, DFT, IC Implementation | Tags: 3DIC, advanced packaging, DRAM, GPU, High Bandwidth Memory, osat, silicon interposer, TSV | Organizations: AMD, Amkor, ASE, SK Hynix, UMC

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