SK Hynix

January 9, 2018

Choosing between DDR4 and HBM in memory-intensive applications

Exploring the tradeoffs between implementing DDR4 and HBM for high-bandwidth memory subsystems.
Article  |  Topics: Embedded - Architecture & Design, IP - Selection  |  Tags: , ,   |  Organizations: , , ,
September 23, 2015

Mounting Fiji: How AMD realized the first volume interposer

AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
Article  |  Topics: EDA - DFM, DFT, IC Implementation  |  Tags: , , , , , , ,   |  Organizations: , , , ,

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