Adoption of high-density advanced packaging (HDAP) needs tools and supports to build designers' confidence in the emerging technology.
Gandharv Bhatara looks at how the OPC and RET elements of Calibre are getting ready for the EUV age.
A new technique has been developed to catch potential new lithography issues when little design data is available for incoming nodes.
John Ferguson reviews the key capital metrics you need to review when deciding whether to move to a new process.
An alphabet soup of AI, HPC, 5G and the IoT has finally seeded creation of a design infrastructure for silicon photonics.
The equipment giant's Computational Process Control strategy takes a pragmatic approach to Industry 4.0 and is likely to influence EDA tools for incoming nodes.
FinFET processes and libraries are maturing, enabling designers to explore the best ways to take advantage of the capabilities of the new transistor design
The 10nm process will see changes to multiple patterning that demands changes in the implementation flow, along with an increased focus on the effects of variability.
AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
In sessions at the 2015 Design Automation Conference, engineers who had worked on finFET-oriented projects revealed how the technology has changed their design practices and where others may want to think twice about making the move.
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