BEOL

April 24, 2020

How to gain a competitive edge with advanced DFT

Learn how the latest design for test innovations deliver efficiency and profitability across the design flow.

Expert Insight | Topics: EDA - DFT | Tags: BIST, built in self test, cell-aware, EDT, embedded deterministic test, fault models, hierarchical DFT, LBIST, logic BIST, MBIST, memory BIST, RTL-DFT integration, scan diagnosis | Organizations: Advantest, Amazon, ARM, Broadcom, GlobalFoundries, Samsung Electronics, Siemens EDA, Teradyne

November 20, 2018

Adding system-level, post-layout electrical analysis to HDAP design and verification

Adoption of high-density advanced packaging (HDAP) needs tools and supports to build designers' confidence in the emerging technology.

Article | Topics: EDA - IC Implementation, Verification | Tags: 2.5D, 3D, foundry, HDAP, high-density advanced packaging, interposer, osat | Organizations: BEOL, Foundry, Siemens EDA

September 14, 2017

Silicon photonics moves out of the shadows

An alphabet soup of AI, HPC, 5G and the IoT has finally seeded creation of a design infrastructure for silicon photonics.

Article | Topics: EDA - DFM, IC Implementation, Verification | Tags: 5G, AI, data center, DFM, foundry, HPC, internet of things, layout, networking, physical verification, server, silicon photonics | Organizations: Amkor, Cisco, GlobalFoundries, Huawei, IBM, Intel, Luxtera, PhoeniX Software, Siemens EDA, ST Microelectronics, TSMC

November 6, 2015

Reducing test costs through multisite and concurrent testing

How to save test time and test costs by doing more tests in parallel, increasing compression, pooling tester memory, managing branching - and more

Article | Topics: EDA - DFT | Tags: concurrent test, multisite test, test compression | Organizations: Advantest, Synopsys

September 23, 2015

Mounting Fiji: How AMD realized the first volume interposer

AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?

Article | Topics: EDA - DFM, DFT, IC Implementation | Tags: 3DIC, advanced packaging, DRAM, GPU, High Bandwidth Memory, osat, silicon interposer, TSV | Organizations: AMD, Amkor, ASE, SK Hynix, UMC

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