Samsung Electronics

November 4, 2014

From Darwin to Mao: how multi-patterning could move up the flow

Are we torn between evolution and revolution? Mentor Graphics' Joe Sawicki discusses how pattern matching already in fabs could move up and radically alter the design flow.
September 10, 2014

Foxconn’s wishlist for wearables and the Internet of Things

Manufacturing giant says we need a new category of WPUs - wearables processing units - to create a mass market and that ARM needs to go smaller than the MO.
June 2, 2014

Samsung certifies Synopsys tools, IP at 14nm

Samsung, Synopsys and ARM have been working together to create a finFET design ecosystem.
Article  |  Topics: Conferences, Design to Silicon, Blog - IP  |  Tags: ,   |  Organizations: , ,
May 17, 2014

Cadence ports IP and qualifies tools for 28nm FD-SOI

Cadence Design Systems has developed two sets of IP aimed at the 28nm FD-SOI process developed by STMicroelectronics and qualified tools for the process.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , ,
May 14, 2014

Samsung agrees to make 28nm FD-SOI

STMicroelectronics has found an alternative production partner for the FD-SOI process that the European chipmaker is presenting as an easier option for SoC designers.
Article  |  Topics: Blog - EDA  |  Tags: ,   |  Organizations: , ,
April 15, 2014

Common Platform foundry alliance to be wound down

But some research and process collaboration is set to continue in the background as Samsung, GlobalFoundries and IBM chart their own priorities.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , , ,
November 13, 2013

TSMC succession plan emphasizes stability

TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
Article  |  Topics: Commentary, Design to Silicon  |  Tags: , , , , , , , ,   |  Organizations: , , ,
October 23, 2013

3D-IC focus for GSA’s Taipei Memory+ event next week

Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.
May 7, 2013

DAC 2013 Preview V: Rounding out the keynotes

Cadence-and-Synopsys co-founder and Freescale's new CEO join the DAC 2013 program, while Qualcomm and TI line up to discuss their work in mobile comms as well as taking your questions.
April 1, 2013

DAC 2013 Preview I: Putting users first and marking 50 years

In the first of our weekly DAC 2013 previews, we discuss program highlights with general chair Yervant Zorian, including an expanded Designer Track, keynotes and golden jubilee celebrations.

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